| MOQ: | 300㎡ |
| Price: | $9.15-$12.39(㎡) |
| Standard Packaging: | Palletize |
| Delivery Period: | 3-7 work days |
| Payment Method: | T/T |
| Supply Capacity: | 15000㎡/month |
| Attribute | Value |
|---|---|
| Grade | T300/T700 |
| Weave Structure | Plain |
| Areal Density (g/m²) | Custom-made |
| Resin Wet-Out Time | ≤20s /≤25s/≤30s |
| Weave Type | Plain |
| Electrical Conductivity | Low |
High-Strength Carbon Fiber Plain Weave Fabric is a cutting-edge composite material engineered for applications demanding uncompromising mechanical integrity and dimensional stability. Constructed from 12K high-modulus carbon fibers arranged in a tightly controlled plain weave pattern, this fabric delivers isotropic strength properties and exceptional resistance to thermal distortion.
| Stage | Technical Specifications |
|---|---|
| Precursor Processing | PAN-based precursor fibers undergo stabilization (250°C) and carbonization (1,800°C) in inert gas. |
| Weaving Automation | Computer-controlled looms ensure ±0.1 mm alignment accuracy in plain weave configuration. |
| Surface Functionalization | Plasma-assisted oxidation (O₂/CF₄) enhances resin adhesion by 60%. |
| Curing Protocol | Dual-stage thermal curing: 150°C phenolic resin curing + 220°C polyimide post-curing. |
| Quality Assurance | AI-driven optical scanning detects fiber misalignment <0.05% in real time. |
| Parameter | Standard Grade | Ultra-High Temp Grade |
|---|---|---|
| Fiber Diameter | 7-10 μm | 5-8 μm |
| Tensile Strength | 4,500 MPa (longitudinal) | 5,200 MPa |
| Thermal Conductivity | 20 W/m*K | 35 W/m*K |
| Electrical Resistivity | 1.2×10⁻³ Ω*cm | 0.8×10⁻³ Ω*cm |
| Moisture Absorption | <0.3% (24h/25°C) | <0.05% |
| Flammability | UL94 V-0 | UL94 V-0 |
| Certifications | ISO 9001, REACH, RoHS | NASA-STD-6012, MIL-I-24768 |
| MOQ: | 300㎡ |
| Price: | $9.15-$12.39(㎡) |
| Standard Packaging: | Palletize |
| Delivery Period: | 3-7 work days |
| Payment Method: | T/T |
| Supply Capacity: | 15000㎡/month |
| Attribute | Value |
|---|---|
| Grade | T300/T700 |
| Weave Structure | Plain |
| Areal Density (g/m²) | Custom-made |
| Resin Wet-Out Time | ≤20s /≤25s/≤30s |
| Weave Type | Plain |
| Electrical Conductivity | Low |
High-Strength Carbon Fiber Plain Weave Fabric is a cutting-edge composite material engineered for applications demanding uncompromising mechanical integrity and dimensional stability. Constructed from 12K high-modulus carbon fibers arranged in a tightly controlled plain weave pattern, this fabric delivers isotropic strength properties and exceptional resistance to thermal distortion.
| Stage | Technical Specifications |
|---|---|
| Precursor Processing | PAN-based precursor fibers undergo stabilization (250°C) and carbonization (1,800°C) in inert gas. |
| Weaving Automation | Computer-controlled looms ensure ±0.1 mm alignment accuracy in plain weave configuration. |
| Surface Functionalization | Plasma-assisted oxidation (O₂/CF₄) enhances resin adhesion by 60%. |
| Curing Protocol | Dual-stage thermal curing: 150°C phenolic resin curing + 220°C polyimide post-curing. |
| Quality Assurance | AI-driven optical scanning detects fiber misalignment <0.05% in real time. |
| Parameter | Standard Grade | Ultra-High Temp Grade |
|---|---|---|
| Fiber Diameter | 7-10 μm | 5-8 μm |
| Tensile Strength | 4,500 MPa (longitudinal) | 5,200 MPa |
| Thermal Conductivity | 20 W/m*K | 35 W/m*K |
| Electrical Resistivity | 1.2×10⁻³ Ω*cm | 0.8×10⁻³ Ω*cm |
| Moisture Absorption | <0.3% (24h/25°C) | <0.05% |
| Flammability | UL94 V-0 | UL94 V-0 |
| Certifications | ISO 9001, REACH, RoHS | NASA-STD-6012, MIL-I-24768 |